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HMC5843
MOUNTING CONSIDERATIONS
The following is the recommend printed circuit board (PCB) footprint for the HMC5843.
PCB Pad Definition and Traces
The HMC5843 is a fine pitch LCC package with a 0.50mm pin pitch (spacing), with the pin pads defined as 0.40mm by
0.25mm in size. PCB pads are recommended to be oversized by 0.025mm from each pad for a short dimension oversize
of 0.05mm. The interior PCB pad is recommended to be 0.05mm oversized per pin with an exterior oversize of 0.20mm
for proper package centering and to permit test probing. Size the traces between the HMC5843 and the external
capacitors (C1 and C2) to handle the 1 ampere peak current pulses with low voltage drop on the traces.
Stencil Design and Solder Paste
A 4 mil stencil and 100% paste coverage is recommended for the electrical contact pads.
Pick and Place
Placement is machine dependant and no restrictions are recommended, and have been tested with mechanical centering.
Placement force should be equivalent 1206 SMT resistors and enough force should be used to squeeze the paste out
from the package/contact pad overlap and to keep the package pin contacts vertical.
Reflow and Rework
This device is classified as MSL 3 with 260 C peak reflow temperature. A baking process (125 C, 24 hrs) is required if
device is not kept continuously in a dry (< 10% RH) environment before assembly. No special profile is required for the
HMC5843 and compatible with lead eutectic and lead-free solder paste reflow profiles. Honeywell recommends the
adherence to solder paste manufac turer’s guidelines. The HMC 5843 may be reworked with soldering irons, but extreme
care must be taken not to overheat the copper pads from the part’s fiberglass substrate. Irons with a tip temperature no
greater than 315°C should be used. Excessive rework risks the copper pads pulling away into the molten solder.
INTERNAL SCHEMATIC DIAGRAM
HMC5843
www.honeywell.com
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